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1
CXL-Compatible
Memory Modules
Michael Abraham
Director, Product Management
Micron Technology, Inc.
2
1. Data center challenges
2. Memory and storage hierarchy
3. Micron CZ120 memory module
4. Database (TPC-H) improvements
5. AI inferencing improvements
6. Enabling in your company
Higher Capacity More Bandwidth Lower Data Center TCO
In-Memory Databases, SaaS, AI
training and inference, General
Purpose compute continue to grow
exponentially, requiring
unconstrained memory capacity to
enable compute to continue to
scale.
The explosion of processor core
counts and the real-time nature
of business is necessitating
memory in the data center to
provide faster data access to
keep compute fed. to keep
compute fed
Data center operators drive to
optimize TCO to deliver the exact
server memory capacity and
bandwidth that workloads require.
Data Center Challenges
Scaling for today’s data center growth plus tomorrow’sAI disruptive needs
4
Memory and
Storage
Hierarchy
Increasing
latency
and
capacity
Increasing
cost
and
bandwidth
Capacity storage
Fast storage
Archival storage
DDR
HBM
Increasingly more workloads are
becoming memory bound and the
data center needs a solution
In package
memory
Storage
5
Memory and
Storage
Hierarchy
Increasing
latency
and
capacity
Increasing
cost
and
bandwidth
Capacity Expansion
Bandwidth Expansion
DDR
In package
memory
Storage
Direct attached
using CXL
HBM
TM
Increasingly more workloads are
becoming memory bound and the
data center needs a solution
Micron Memory Expansion
Modules using CXL are the solution by
adding memory capacity and bandwidth
Capacity storage
Fast storage
Archival storage
DDR
6
Introducing Micron CZ120 Memory
Delivering capacity, bandwidth, flexibility
128GB / 256GB
Up to 2TB incremental server capacity supporting CXL 2.0
36GB/s
Up to 34% increased server memory bandwidth
memory bandwidth per module using PCIe® Gen5 x8
E3.S 2T x8
Industry-standard form factor for broad deployment
1. By adding 8x256GB CZ120s, system limitations apply
2. Memory Latency Checker bandwidth compared to 12-channel 4800MT/s RDIMM server
2
1
7
TPC-H: DRAM vs. Software-tiered memory
CXL improves MSSQL performance of both 64GB and 96GB RDIMMs by 60% or more
CXL can provide better performance for capacity intensive workloads
8
Learn more about CXL™ and
Micron CZ120
Qualify your server platforms by enrolling in the
Micron Technology Enablement Program (TEP)
and leverage our world-class collaboration
▪ Hands-on support to aid in the development
of CXL-enabled designs
▪ Technical resources including data sheets,
electrical and thermal models to aid in product
development and evaluation, and engineering
consultation related to signal integrity and
other technical support topics
▪ Access to other ecosystem partners who can
aid in system-level design
Learn more www.micron.com/CXL
9
Q&A
10
© 2024 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. All information is provided
on an “AS IS” basis without warranties of any kind. Statements regarding products, including statements regarding product features, availability, functionality,
or compatibility, are provided for informational purposes only and do not modify the warranty, if any, applicable to any product. Drawings may not be to scale.
Micron, the Micron logo, and other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.

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Q1 Memory Fabric Forum: Micron CXL-Compatible Memory Modules

  • 1. 1 CXL-Compatible Memory Modules Michael Abraham Director, Product Management Micron Technology, Inc.
  • 2. 2 1. Data center challenges 2. Memory and storage hierarchy 3. Micron CZ120 memory module 4. Database (TPC-H) improvements 5. AI inferencing improvements 6. Enabling in your company
  • 3. Higher Capacity More Bandwidth Lower Data Center TCO In-Memory Databases, SaaS, AI training and inference, General Purpose compute continue to grow exponentially, requiring unconstrained memory capacity to enable compute to continue to scale. The explosion of processor core counts and the real-time nature of business is necessitating memory in the data center to provide faster data access to keep compute fed. to keep compute fed Data center operators drive to optimize TCO to deliver the exact server memory capacity and bandwidth that workloads require. Data Center Challenges Scaling for today’s data center growth plus tomorrow’sAI disruptive needs
  • 4. 4 Memory and Storage Hierarchy Increasing latency and capacity Increasing cost and bandwidth Capacity storage Fast storage Archival storage DDR HBM Increasingly more workloads are becoming memory bound and the data center needs a solution In package memory Storage
  • 5. 5 Memory and Storage Hierarchy Increasing latency and capacity Increasing cost and bandwidth Capacity Expansion Bandwidth Expansion DDR In package memory Storage Direct attached using CXL HBM TM Increasingly more workloads are becoming memory bound and the data center needs a solution Micron Memory Expansion Modules using CXL are the solution by adding memory capacity and bandwidth Capacity storage Fast storage Archival storage DDR
  • 6. 6 Introducing Micron CZ120 Memory Delivering capacity, bandwidth, flexibility 128GB / 256GB Up to 2TB incremental server capacity supporting CXL 2.0 36GB/s Up to 34% increased server memory bandwidth memory bandwidth per module using PCIe® Gen5 x8 E3.S 2T x8 Industry-standard form factor for broad deployment 1. By adding 8x256GB CZ120s, system limitations apply 2. Memory Latency Checker bandwidth compared to 12-channel 4800MT/s RDIMM server 2 1
  • 7. 7 TPC-H: DRAM vs. Software-tiered memory CXL improves MSSQL performance of both 64GB and 96GB RDIMMs by 60% or more CXL can provide better performance for capacity intensive workloads
  • 8. 8
  • 9. Learn more about CXL™ and Micron CZ120 Qualify your server platforms by enrolling in the Micron Technology Enablement Program (TEP) and leverage our world-class collaboration ▪ Hands-on support to aid in the development of CXL-enabled designs ▪ Technical resources including data sheets, electrical and thermal models to aid in product development and evaluation, and engineering consultation related to signal integrity and other technical support topics ▪ Access to other ecosystem partners who can aid in system-level design Learn more www.micron.com/CXL 9
  • 11. © 2024 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Statements regarding products, including statements regarding product features, availability, functionality, or compatibility, are provided for informational purposes only and do not modify the warranty, if any, applicable to any product. Drawings may not be to scale. Micron, the Micron logo, and other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.